Release date | January 10, 2023 |
---|---|
Designed by | Intel |
Manufactured by | Lotes |
Type | LGA-ZIF |
Chip form factors | Flip-chip |
Contacts | 4677 |
FSB protocol | PCI Express (PCIe) Direct Media Interface (DMI) Ultra Path Interconnect (UPI) |
FSB frequency | 16 GT/s to 20 GT/s UPI |
Processor dimensions | 77.5 mm x 56.5 mm |
Processors | |
Predecessor | LGA 4189 |
Successor | LGA 7529 |
Memory support | DDR5 with ECC support |
This article is part of the CPU socket series |
LGA 4677 (Socket E) is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel, compatible with Sapphire Rapids server and workstation processors, which was released in January 2023.[1][2][3]
Features
- Support for PCI Express 5.0[4] and Direct Media Interface 4.0
- Supports 8 channels of DDR5 RAM with error correction code support
Chipsets
Chipset | |||||
---|---|---|---|---|---|
C741 | W790 | ||||
Release date | January 2023 | March 2023 | |||
Price (USD) | $70 | $72 | |||
Overclocking | No | Yes | |||
Bus Interface | DMI 4.0 x8 | DMI 4.0 x8 | |||
CPU support | Sapphire Rapids-SP Emerald Rapids-SP |
Sapphire Rapids-WS Sapphire Rapids-64L Sapphire Rapids-112L | |||
Socket count | 1s or 2S | 1S | |||
Memory capacity |
Up to 4 TB with one CPU or 8 TB with two CPUs | Up to 2 TB (on 2400 models) Up to 4 TB (on 3400 models) | |||
Maximum DIMM slots |
8 (1 CPU)
16 (2 CPUs) |
4 | |||
Maximum USB 2.0 ports |
14 | 14 | |||
USB 3.2 ports configuration |
Gen 1 (5 Gbit/s) |
10 | 10 | ||
Gen 2 |
x1 (10 Gbit/s) |
10 | |||
x2 (20 Gbit/s) |
5 | ||||
Maximum SATA 3.0 ports |
20 | 8 | |||
Processor PCI Express configuration |
5.0 | Up to 80 lanes | Up to 112 lanes | ||
4.0 | No support | ||||
PCH PCI Express configuration |
4.0 | — | 16 | ||
3.0 | 20 | 12 | |||
Independent display support (digital ports/pipes) |
Undisclosed | ||||
Wireless | Integrated | No | Intel Wi-Fi 6E AX211 (Garfield Peak 2) | ||
Discrete | Intel Wi-Fi 6E AX211 (Typhoon Peak 2) | ||||
PCIe RAID support |
Undisclosed | ||||
SATA RAID support | |||||
Intel Optane Memory support | |||||
Intel Smart Sound Technology |
No | Yes | |||
Intel Active Management, Trusted Execution and vPro Technology |
Yes | ||||
Chipset TDP |
11 W | 6 W | |||
Chipset package size |
22 mm × 23 mm 506 mm2 |
28 mm × 25 mm 700 mm2 | |||
See also
References
- ↑ Mujtaba, Hassan (April 23, 2022). "Next-Gen AMD SP5 For EPYC Genoa & Intel LGA 4677 For Xeon Sapphire Rapids-SP Server CPU Platform Pictured, Over 30 VRMs & 32 DDR5 DIMM Slots In Dual-Socket Config". Wccftech. Retrieved November 19, 2022.
- ↑ "Intel 4th Gen Xeon "Sapphire Rapids" CPU for LGA4677-X socket pictured". VideoCardz. February 4, 2021. Retrieved November 19, 2022.
- ↑ Paul Alcorn (February 15, 2023). "Intel Launches Overclockable Xeon W CPUs up to 56 Cores: a Return to HEDT-Class Chips". Tom's Hardware. Retrieved March 18, 2023.
- ↑ "Intel Xeon Sapphire Rapids CPUs with DDR5 memory have been tested in AIDA64". VideoCardz. February 12, 2022. Retrieved November 19, 2022.
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