PlayStation VR Processor Unit Thermal Pad / Fan Replacement

Written By: Kalib Ellery
  • Comments: 4
PlayStation VR Processor Unit Thermal Pad / Fan Replacement

Difficulty

Moderate

Steps

4

Time Required

10 minutes

Introduction

This guide applies to the CUH-ZVR2 processor unit.

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    • Place the PlayStation VR processor unit with the I/O (back) side facing up.

    • Peel the sticker up with a fingernail or a pry tool.

    • Remove the single J0 screw.

    • Place the screw in a parts tray to keep it organized.

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    • Use an opening tool to separate the bottom cover from the top.

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    • Remove the eight J0 screws.

    • Place the screws in the parts tray

    • Use your tweezers to disconnect the fan connector from the motherboard

    • If the fan needs to be replaced, stop here and follow in reverse.

    • Fan details.

    • Brand: Nidec

    • Model and dimensions: U35x05m 52aa7-56j14

    • Power: 5v and .18a

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    • Use a spudger or a fingernail to lift the pcb in the direction highlighted

    • Gently separate the metal plate from pcb

    • Replace the thermal paste if needed.

    • Use a fingernail or a pry tool to see if the thermal pad is still soft. that means it still conducts heat. if hard, remove and replace the thermal pad

    Hi. I'd like you to be more specific on the thermal pad dimensions. I just find them pre-cut at local stores.

    Alex Largacha -

Conclusion

To reassemble your device, follow these instructions in reverse order.

Author

Kalib Ellery

Member since: 17/10/16

519 Reputation

3 comments

Hi, is thermal pads being dry could be the reason for this processing unit not turning on? It lits the light for quick millisecond and goes out as i connect the barrel jack. :( I couldn't find any fix yet

Chandu Samarasekara -

Is it neccessary to replace the thermal pad with another pad , or may I use normal thermal paste?

DasNexus -

It must be replaced with another new thermal pad of the same thickness, in this case a 2mm pad. If you use thermal paste, there will be a lot of space between the heatsink and the chip, which could cause failures and overheating.

Rixson Perez -